Course: electronic packaging

Course no. :n/a
ECTS credits:2.5
Lecturer(s):Prof. Dr.-Ing. H. Köster
Available: winter term summer term
Course type:Lecture/practical exercises
Exam type:Written e. 1h or oral examine
Exam requirements: 
Objectives:After successful participation in the module, the students have knowledge of the current mounting and connection technologies of electronic systems. They have Knowledge of production, assembly and testing technologies, basic knowledge of assembly techniques of all common technologies, basic knowledge of DFX (manufacturing, quality) techniques.
Course contents:Circuit board technologies, Chip mounting technologies, manufacturing processes of Multi Chip Modules; Technologies like SOS etc. Design to cost, Design for Manufacturing aspects
Literature:Philip E. Garrou. Iwona Turlik, Muliti Chip Module Technology Handbook, MC Graw Hill,
Clyde, F. ; Commbs, JR., Printed Circuit Handbook, MC Graw Hill, 5. Edition
Garrou, Philip E.; Mutlichip Modules Technology Handbook, Mc Graw Hill, ISBN 0-07-022894-9
Lau, John H.; Chip on Board, Van Nostrand Reinhold, ISBN 0-442-01441
available in modul:technical compulsory elective bachelor in semester 6